MaAnt 0.12mm Square Hole BGA Reballing Stencil For iPhone 6-16 Pro Max

MaAnt Comprehensive BGA Reballing Stencil for iPhone 6-16 Pro Max motherboard CPU NAND IC Tin Planting Soldering Repair. MaAnt 0.12mm square hole steel mesh reballing stencil for iPhone 6-16 Pro Max A8-A18 Pro CPU Nand WIFI and other chips.

Features:

1. The strong steel is not easy to deform at high temperature.
2. Square hole fillet design, high precision, burr-free, no tin jam up.
3. Keep the flexibility of steel for a long time, normal deformation and bending, and easy to restore immediately.
4. Accurate alignment, good flexibility, durability, and high-temperature resistance give you a different tin planting experience.
5. The tin ball is full and round, square hole chamfered tin planting black net makes every tin ball of you rounder and fuller.
6. Imported alloy steel with good high-temperature resistance and metal fatigue resistance, making the service life of the product more lasting.
7. Accurate alignment, each mesh is checked according to the original drawing to ensure that there should be no fewer solder joints, which are completely consistent and accurately aligned.
8. For iPhone 6/6 Plus/6S/6S Plus/7/7 Plus/8/8 Plus/X/XS/XS Max/XR/11/11 Pro/11 Pro Max/12/12 Mini/12 Pro Max/13/13 Mini/13 Pro Max/ 14/ 14 Plus/14 Pro/14 Pro Max/15/15 Plus/15 Pro/15 Pro Max/16/16 Plus/16 Pro/16 Pro Max.